Xingchang Wei

Personal Profile

Since 2010, Zhejiang University, Department of Information and Electronic Engineering, Professor, doctoral tutor, deputy director of Institute of Electronic Information Technology and Systems;

July 2013-August 2013, visiting scholar, Korea Advanced Institute of Science and Technology (KAIST);

2001-2010, Singapore Institute of High Performance Computing, post doctorate (2001-2003), researcher (2003-2005), Senior researcher (2005-2009), research scientist (2010);

1998-2001, electromagnetic field and microwave technology in Xi'an University of Electronic Science and Technology of, doctoral degree;

1995-1998, electromagnetic field and microwave technology in Xi'an University of Electronic Science and Technology, master degree;

1991-1995, microwave communication engineering in Xi'an University of Electronic Science and Technology of, Bachelor of Engineering.

His research areas focus on chip, package and PCB board-level power integrity, signal integrity analysis, graphene RF devices and RF circuit analysis, and related application of computational electromagnetic algorithm research. He has published more than 50 papers in the famous international journals such as IEEE Transactions and international conferences, and he is the co-author of an English academic monograph and an international patent. He awarded Singapore 2007 IES Prestigious Engineer Archievement Award, China’s Ministry of Education 2009 New Century Excellent Talent Support Program, Best Conference Paper Award of Asia-Pacific Symposium on Electromagnetic Compatibility (Singapore, 2012). He is IEEE Senior Member, and used to be Co-Chairman of the Technical Committee of the IEEE Advanced Packaging and Systems Design Conference (Singapore 2010), program committee chair (Singapore, 2012)  and technical program committee member (Beijing 2010; Korea, 2013; Melbourne, 2013) technical program committee member of  the Asia-Pacific International Microwave Conference (Singapore, 2009)

Job Opportunities

1. Electromagnetic compatibility of high-speed circuit
2. The design and electrical performance analysis of three-dimensional integration (through-silicon via)
3. The analysis and design of Micro-nano RF device
4. Microwave radio frequency antenna and circuit

Welcome to students study in electromagnetic field microwave technology and related majors apply for master degree, doctoral degree, and post-doctoral researcher.Please send your resume to the mailbox:

The salary of post-doctoral researcher is based on the regulation of Zhejiang University (please check it on Zhejiang University postdoctoral office website:, and it can be negotiated according to the candidates’ ability and work. A good research work environment and great personal development opportunity will be provided.

Research Areas
Analysis and design of graphene RF devices, analysis and design of electromagnetic characteristics of three-dimensional integrated circuits andthrough-silicon via, electromagnetic interference of PCB board and package level, power integrity, signal integrity analysis, microwave antenna and RF circuit analysis, computational electromagnetic.

Contact Information
Tel: 0571-87953869