Xingchang Wei

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Advanced 3D Integration and System Level Packaging
Metamaterials and Electromagnetic Cloak
Novel 2D Materials and Micro / Nano Device Integration
Computational Electromagnetics and High Performance Multiphysics Simulation
Microwave Remote Sensing
Complex Electromagnetic Environment Sensing
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Xingchang Wei

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Method of analysing signal interactions in electronic packaging, US Provisional Patent Application No. 61/032,803.

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