People

Xingchang Wei

  1 National Natural Science Foundation Item (61274110): high frequency electromagnetic analysis and optimization design of silicon-through via

2 Specialized Research Fund for the dDctoral Program of Higher Education of China (20120101110034): electromagnetic and microelectronic integration analysis and design method of three-dimensional silicon-through via integrated circuit

  3 The key project of the Zhejiang Natural Science Found (LZ12F04001) electromagnetic modeling and analysis of the silicon-through via

4 The key project of National Natural Science Found (1131002): the metamaterial research of integrated active and micro / nano lumped parameter elements
  5 School enterprise cooperation fund (111404-I21201): ground technology of multilayer layers PCB board
  6 Ministry of Education New Century Excellent Talent Support Program (NCET-09-0697): the electromagnetic compatibility analysis of integrated circuit and package

7 The Fundamental Research Funds for the Central Universities (2012QNA5017): Electromagnetic - microelectronics hybrid modeling of complex 3D Integration

8 The Fundamental Research Funds for the Central Universities (2010QNA5028): the electromagnetic compatibility simulation and design of the ultra high speed integrated circuit package and silicon-through via
  9 SERC Aerospace Program Grand No 092 155 0102 Modeling of electromagnetic interactions between transmitters and receivers in a closed environment
  10 IHPC/ESA-08-1 Wireless platform of renewable energy collection using  wireless and solar cell
  11 IHPC/EMC/02/211 Reverberation chamber modeling and its control software development
  12 IHPC/EMC/03/289 Research and development of advanced algorithm for complex electromagnetic compatibility computation