People
1 National Natural Science Foundation Item (61274110): high frequency electromagnetic analysis and optimization design of silicon-through via
2 Specialized Research Fund for the dDctoral Program of Higher Education of China (20120101110034): electromagnetic and microelectronic integration analysis and design method of three-dimensional silicon-through via integrated circuit
3 The key project of the Zhejiang Natural Science Found (LZ12F04001) electromagnetic modeling and analysis of the silicon-through via
4 The key project of National Natural Science
Found (1131002): the metamaterial research of integrated active and micro /
nano lumped parameter elements
5 School enterprise
cooperation fund (111404-I21201): ground technology of multilayer layers PCB
board
6 Ministry of Education New Century
Excellent Talent Support Program (NCET-09-0697): the electromagnetic
compatibility analysis of integrated circuit and package
7 The Fundamental Research Funds for the Central Universities (2012QNA5017): Electromagnetic - microelectronics hybrid modeling of complex 3D Integration
8 The Fundamental Research Funds for the Central Universities (2010QNA5028): the electromagnetic compatibility simulation and design of the ultra high speed integrated circuit package and silicon-through via