Advanced three bit integrated system level package for electric heating problems and high speed signal transmission characteristics research, National Natural Science Foundation of china;
  Analysis of electromagnetic problems and key technologies of three dimensional integrated circuits, National Natural Science Foundation of china;
  CMOS process compatible surface plasmon micro nano devices and its integration technology based on the key projects of natural fund of Zhejiang province;
  Research on the electromagnetic characteristics of the new integrated circuit and packaging, the research foundation of HUAWEI Technology Co., ltd.;
  Integrated innovation research of micro and nano electronic systems, Central Research Fund of Zhejiang University;
  Study on the microwave and millimeter wave devices and systems of surface plasmon.