专著Er-Ping Li（李尔平）, Electrical Modeling and Design for 3D System Integration: Signal integrity /power integrity and EMC for packaging and integrated circuits, Wiley-IEEE Press. New York, USA, 2012
专著Er-Ping Li（李尔平） and Hong-Son Chu, Plasmonics Nanoelecrronics and Sensing Devices, Cambridge University Press（剑桥大学出版社） , Feb. 2014
PUBLISHED BOOK CHAPTERS（出版章节）
[1] Time domain modeling and simulation from nnanoelectronics to nanophotonics, Computational electromagnetics, retrospective and outlook, Springer,Germany, 2015
[2] Chapter 18: Modeling the quantum effects in electromagnetics devices, Computational Electromagnetics, Editor, Raj Mittra, Springer, Germany, 2013
[3] Chapter 8: FDTD Modeling of Active Plasmonics in the book: Advances in FDTD computational Electrodynamics: Photonics and Nanotechnology, Edited by Allend Taflove(Northwester University) and John Jackson(MIT), Artech House, Boston, USA, 2013
[4] Chapter: T-matrix analysis of multiple scattering from parallel semi-circular channels filled with chiral media in a conducting plane, in Book Progress in Electromagnetics Research, J. A. Kong (MIT), USA, PIERS vol.53, pp.299-318, 2005.
[5] Chapter: A novel coupled T-matrix and microwave network approach for multipole scattering from parallel semicircular channels with eccentric cylindrical inclusions, in Book Progress in Electromagnetics Research, J. A. Kong (MIT),USA, PIERS vol.53, pp.109-133, 2005.
[6] Chapter: Factorization of potential and field distributions without utilizing the additional theorem, Computational Methods in Large Scale Simulation, Editor: Lam Kim Yong, World Scientific Publishing, 2005.
