国际学术任职:
1. 2013-present: IEEE Fellow;
2. Guest Co-editor of the Special Issue of 《EMC in Near Field》in IEEE Trans. Electromagnetic Compatibility, 2016;
3. 2017.01-present: Associate Editor of 《IEEE Journal on Multiscale and Multiphysics Computational Techniques》;
4. 2011-present: Associate Editor of 《IEEE Transactions on Components, Packaging, and Manufacturing Technology》;
5. 2011-2017.02: Associate Editor of《International Journal of Numerical Modeling of Electronic Networks, Devices and Fields》;
6. 2011-2012: IEEE Electromagnetic Compatibility Society Distinguished Lecturer;
7. 2011 General Co-Chair of 2011 IEEE Electrical Design of Advanced Packaging Symposium (2011 IEEE EDAPS);
8. 2010-2014: Editorial Board Member of 《International Journal of RF and Microwave CAE》 ;
9. 2001-present: Editorial Board Member of 《Journal of Electromagnetic Waves and Applications》and《Progress in Electromagnetics Research》;
10. Technical Chair of Electrical Design of Advanced Packaging and Systems (EDAPS 2005) ;