Journal Papers in English
  [1] G. P. Zou, X. C. Wei, E. P. Li, X. Cui, and W. D. Zhang, "Modeling of the Simultaneous Switching Noise in High Speed Electronic Circuit with the Integral Equation Method and Vector Fitting Method," IEEE Trans. Magnetics, vol. 47, no. 5, pp.1490-1493, May 2011.
  [2] X. C. Wei, G. P. Zou, E. P. Li, and X. Cui,"Extraction of Equivalent Network of Arbitrarily Shaped Power-Ground Planes with Narrow Slots using a Novel Integral Equation Method," IEEE Trans. Microwave Theory Tech., vol. 58, no. 11, pp.2850-2855, 2010.
  [3] X. C. Wei, Z. G. Shi, and E. P. Li, "A Novel Combined Equivalent Networks Analysis for Power and Ground Planes with Narrow Slots", IEEE Trans. Electromagn. Compat., vol. 52, no. 4, pp.994-1000, 2010.
  [4] X. C. Wei and E. P. Li, “Integral-equation equivalent-circuit method for modeling of noise coupling in multilayered power distribution networks,” IEEE Trans. Microwave Theory Tech., vol. 58, no. 3, pp.559-565, Mar. 2010.
  [5] G. P. Zou, E. P. Li, X. C. Wei, G. X. Lou, and X. Cui, “A new hybrid field-circuit approach to model the power-ground planes with narrow slot,” IEEE Trans. Electromagn. Compat., vol. 52, no. 2, pp.340-345, May 2010.
  [6] Y. J. Zhang, Z. Z. Oo, X. C. Wei, E. X. Liu, E. P. Li, and J. Fan, “Systematic microwave network analysis for multilayer  printed circuit boards with vias and decoupling capacitors,” IEEE Trans. Electromagn. Compat., vol. 52, no. 2, pp.401-409, May 2010.
  [7] E. P. Li, X. C. Wei, A. C. Cangellaris, E. X. Liu, Y. J. Zhang, M. D’Amore, J. Kim, and  T. Sudo, “Overview of EMC, Signal and Power Integrity Solutions in High-Speed Electronics,” IEEE Trans. Electromagn. Compat., vol. 52, no. 2, pp.248-265, May 2010.
  [8] P. Bai, M. X. Gu, X. C. Wei, and E. P. Li, “Electrical detection of plasmonics waves using an ultra-compact structure via a nanocavity,” Opt. Express, vol. 17, no. 26, pp.24349-24357, Dec. 2009.
  [9] E. X. Liu, E. P. Li, Z. Z .Oo, X. C. Wei, Y. J. Zhang, and R. Vahldieck, “Novel methods for modeling of multiple vias in multilayered parallel-plate structures,” IEEE Trans. Microwave Theory Tech., vol. 57, no. 7, pp. 1724-1733, 2009.
  [10] Z. Z. Oo, E. P. Li, X. C. Wei, E. X. Liu, Y. J. Zhang, and L. W. Li, “Hybridization of the scattering matrix method and modal decomposition for analysis of signal traces in a power distribution network,” IEEE Trans. Electromagn. Compat., vol. 51, no.3, Part2, pp.784-791, Aug. 2009.
  [11] X. C. Wei, E. P. Li, Y. L. Guan, and Y. H. Chong, “Simulation and experimental comparison of different coupling mechanisms for the wireless electricity transfer”, J. of Electromagn. Waves and Appl., vol. 23, no. 7, pp. 925-934, 2009.
  [12] X. C. Wei, E. P. Li, E. X. Liu, and R. Vahldieck, “Efficient simulation of power distribution network by using integral equation and modal decoupling technology,” IEEE Trans. Microwave Theory Tech., vol. 56, no. 10, pp. 2277-2285, Oct. 2008.
  [13] X. C. Wei, E. P. Li, E. X. Liu, E. K. Chua, Z. Z. Oo, and R. Vahldieck, “Emission and susceptibility modeling of finite-size power-ground planes using a hybrid integral equation method,” IEEE Trans. Adv. Packag., vol. 31, no. 3, pp. 536-543, Aug. 2008.
  [14] X. C. Wei, E. P. Li, E. X. Liu, and X. Cui, “Efficient modeling of re-routed return currents in multilayered power-ground planes by using integral equation,”  IEEE Trans. Electromagn. Compat., vol.50 , no. 3, pp. 740-743, Aug. 2008.
  [15] Z. Z. Oo, E. X. Liu, E. P. Li, X. C. Wei, Y. J. Zhang, Tan, M., L. W. Joshua Li, R. Vahldieck, “A Semi-analytical approach for system-level electrical modeling of electronic packages with large number of vias,”  IEEE Trans. Adv. Packag., vol. 31, no. 2, pp. 267-274, May 2008.
  [16] X. C. Wei and E. P. Li, “Transmitting antenna’s reflected power and its influence on reverberation chamber calibration,” IEEE Trans. Electromagn. Compat., vol. 49, no. 1, pp. 192-194, Feb. 2007.
  [17] E. P. Li and X. C. Wei, “Reverberation chamber for EMC testing,” Interference Technology, Aug. 2007, online available: http://www.interferencetechnology.com/articles/articles/article/reverberation-chamber-for-emc-testing.html.
  [18] X. C. Wei and E. P. Li, “Efficient EMC simulation of enclosures with apertures residing in an electrically large platform using the MM-UTD method,” IEEE Trans. Electromagn. Compat., vol.47, no.4, pp.717-722, Nov. 2005.
  [19] X. C. Wei, E. P. Li, and Y. J. Zhang, “Efficient solution to the large scattering and radiation problem using the improved finite element-fast multipole method,” IEEE Trans. Magn., vol. 41, no.5, pp.1684-1687, May 2005.
  [20] X. C. Wei, Y. J. Zhang, and E. P. Li, “The hybridization of fast multipole method with asymptotic waveform evaluation for the fast monostatic RCS computation,” IEEE Trans. Antennas Propagat., vol. 52, no. 2, pp.605-607, Feb. 2004.
  [21] X. C. Wei, E. P. Li, and Y. J. Zhang, “Application of the improved finite element-fast multipole method on large scattering problems,” Progress in Electromagnetics Research, vol. 47, pp. 49-60, 2004.
  [22] Y. J. Zhang, X. C. Wei, and E. P. Li, “Electromagnetic scattering from three-dimensional bianisotropic objects using hybrid finite element-boundary integral method,”J. Electromagn. Waves And Appl. Vol. 18, no.11, pp.1549-1563, 2004.
  [23] X. C. Wei and E. P. Li, “Wide-band EMC analysis of on-platform antennas using impedance matrix interpolation with the moment method-physical optics method,” IEEE Trans. Electromagn. Compat., vol. 45, no.3, pp.552-556, Aug. 2003.
  [24] X. C. Wei, E. P. Li, and C. H. Liang, “Fast solution for large scale electromagnetic scattering problems using wavelet transform and its precondition,” J. Electromagn. Waves And Appl., vol.17, no.4, pp.611-613, Apr. 2003.
  [25] X. Wei, E. Li, and C. Liang, “Wavelet method in the solution of magnetic field integral equation,” IEE Proc.-Sci. Meas. Technol., vol.149, no.5, pp.286-288, Sept. 2002.
  [26] X. C. Wei, E. P. Li, and C. H. Liang, “A new MRTD scheme based on Coifman scaling functions for the solution of scattering problems,” IEEE Microw. Wireless Compon. Lett., vol. 12, no.10, pp.392-394, Oct. 2002.
Conference Papers in English
  [27] X. C. Wei and E. P. Li, “A System-Level Equivalent Circuit Method for the Electrical Performance Modeling of Electronic Packages,” 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP),Xi'an, China, pp.683-686, Aug. 16-19, 2010.
[28] X. C. Wei and E. P. Li, “Design and Modelling of a Cost-Effective Embedded Filter for Low-Impedance Power Distribution Network,” IEEE International Conference on Electrical Performance and Electronic Packaging and Systems (EPEP), Oct. 2010, Austin, Texas.
  [29] X. C. Wei, L. S. Zhang, and E. P. Li, “Design and modeling of cost‐effective filter structures for improved power integrity”,会议报告, 2010 IEEE Electrical Design of Advanced Package & Systems Symposium, Dec.7-9, Singapore.
  [30] Z. Z. Oo, E. X. Liu, X. C. Wei, Y. J. Zhang, and E. P. Li , “Analysis of SMT decoupling capacitor placement in electronic packages using hybrid modeling method,” 12th International Symposium on Integrated Circuits, Singapore, Dec. 14-16, 2009.
  [31] Y. Zhang, E. Li, Z. Oo, W. Zhang, E. Liu, X. Wei, and J. Fan, “Analytical formulas for the barrel-plate and pad-plate capacitance in the physics-based via circuit model for signal integrity analysis of PCBs,“ 2009 Asia-Pacific Microwave Conference, Suntec, Singapore, Dec 7-10, 2009.
  [32] G. Zou, E. Li, X. Wei, X. Cui, and G. Luo, "Modeling of arbitrary power-ground planes with slot by using integral equation and transmission line method," 2009 Asia-Pacific Microwave Conference, Suntec, Singapore, Dec 7-10, 2009.
  [33] X. Wei, M. Gu, P. Bai, and E. Li, “Turning plasmonic wave transmission and reflection with nanocircuit loads in  plasmonic circuitry”, 2009 Asia-Pacific Microwave Conference, Suntec, Singapore, Dec 7-10, 2009.
  [34] X. C. Wei, E. P. Li, and E. X. Liu, “An efficient equivalent circuit model for the EMC analysis of power/ground noise,” 12th Workshop on Signal Propagation on Interconnection, pp. 1-4, Avignon, Popes’ Palace, France, May 12-15, 2008.
[35] Liu, EX, Wei, XC, Oo, ZZ, and Li, EP, “An efficient method for power integrity and EMI Analysis of advanced packages,” 58th Electronic Components and Technology Conference, pp.652-657, Orlando, FL, 2008.
   [36] E. P. Li, X. C. Wei, E. X. Liu, and Z. Z. Oo, “Advanced parallel algorithm for the system-level EMC modeling of high-speed electronic package,” 2008 IEEE EMC Symposium, pp.1-5, Detroit, USA, Aug 18-22, 2008.
[37] Zaw, ZO, Wei XC, Liu, EX, Li EP, and Li LW, “Efficient Analysis for Multilayer Power-Ground Planes with Multiple Vias and Signal Traces in an Advanced Electronic Package,” 2008 IEEE-EPEP Electrical Performance Of Electronic Packaging, pp.85- 88, San Jose, CA, Oct. 27-29, 2008.
    [38] E. X. Liu, E. P. Li, and X.C. Wei, “ Thermal-Aware Electrical Analysis of High-Speed Interconnect,” 2008 Electrical Design Of Advanced Packaging and Systems Symposium, pp.171-174, Seoul, South Korea, Dec 10-12, 2008.
  [39] E. X. Liu, X. C. Wei, Z. Z. Oo, and E. P. Li, “A 2D Time Domain Method for Electrical Analysis of Electronic Packages,” 2008 10th Electronics Packaging Technology Conference, pp.254-259, Singapore, Dec 09-12, 2008.
  [40] Z. Z. Oo, E. X. Liu, X. C. Wei, M.T.Y. Choon, E. P. Li, Y. J. Zhang, and L. W. Li, "Hybrid of scattering matrix method and integral equation used for co-simulation of power integrity and EMI in electronic package with large number of P/G vias," 57th Electronic Components and Technology Conference, pp.815-820, Reno NV, USA, May 30-June 1, 2007.
  [41] X. C. Wei, E. X. Liu, Z. Z. Oo, E. P. Li, and R. Vahldieck, “A Novel approach for system level package modeling to address signal and power integrity issues,” 57th Electronic Components and Technology Conference, pp.1653-1658, Reno NV, USA, May 30-June 1, 2007.
  [42] E. P. Li,E. X. Liu, Z. Oo, X. C. Wei, Y.J. Zhang,and R. Vahldieck, “A systematic semi-numerical approach for modeling of signal and power integrity of electronic packages,” 2007 IEEE International Symposium On Electromagnetic Compatibility, Workshop And Tutorial Notes, pp.958-963, Honolulu, HI, Jul 08-13, 2007.
  [43] Z. Z. Oo, E. X. Liu, X. C. Wei, E. P. Li, E. K. Chua, and L. W. Li, “ Novel co-simulation method for analysis of power integrity and EMI in electronic packages with large number of power/ground vias,” 2007 9th Electronics Packaging Technology Conference, pp.421-424, Singapore, Dec 10-12, 2007.
  [44] X. C. Wei and E. P. Li, “Reflection of transmitting antenna in reverberation chamber and its effect on chi-square validation,” IEEE AP-S International Symposium USNC/URSI National Radio Science Meeting AMEREM Meeting, Albuquerque, New Mexico, USA, July 9-14, 2006.
  [45] L. M. Deng, X. C. Wei, E. P. Li, and Y. L. Lu, “An improved printed double-Y balun,” 17th International Zurich Symposium on Electromagnetic Compatibility, Suntec International Convention & Exhibition Centre, Singapore, Feb. 27–Mar 3, pp.187-189, 2006.
  [46] X. C. Wei, E. P. Li, Y. J. Zhang and S. Wang, “Efficient simulation of EMI induced in the platform-mounted antennas using a hybrid moment methods-physical optics method,” IEEE International Electromagnetic Compatibility Symposium, pp.505-508, Navy Pier, Chicago, Illinois, USA, Aug. 8-12, 2005.
  [47] X. C. Wei and E. P. Li, “Hybrid method for efficient shielding analysis of platform-mounted enclosures,” 15th Conference on the Computation of Electromagnetic Fields, Shenyang Liaoning, China, Jun. 26-30, 2005.
  [48] X. C. Wei, E. P. Li, and Y. J. Zhang, “Efficient solution to the large scattering and radiation problem using the improved finite element-fast multipole method,” in Proc. 11th Biennial IEEE Conference on Electromagnetic Field Computation (CEFC 2004), Seoul, Korea, Jun. 6-9, 2004.
  [49] X. C. Wei, E. P. Li, Y. J. Zhang and S. Wang, “Advanced EM technique for system level electromagnetic compatibility prediction,” CSE Symposium, Grand Copthorne Waterfront Hotel, Singapore, Jul. 2nd, 2004.
  [50] X. C. Wei and E. P. Li, “Analysis of antennas on large platforms using PO-MM hybrid method,” Progress in Electromagnetics Research Symposium, Singapore, pp.101, Jan. 2003.
中文期刊论文
  [51] X. C. Wei and C. H. Liang, “Using wavelet-MOM to solve the problem of scattering from three dimensional cavities,” J. Electronics & Information Technology, Vol.24, No.11, pp.1692-1697, 2002.
  [52] X. C. Wei and C. H. Liang, “On the use of Coifman intervallic scaling functions in the solution of electromagnetic field integral equation,” J. Electronics & Information Technology, Vol.24, No.10, pp.1437-1440, 2002.
  [53] X. C. Wei, X. W. Shi and C. H. Liang, “Using preconditioning to accelerate the computing in wavelets-MOM,” J. Microwaves, No.2, 2001.
  [54] X. C. Wei and C. H. Liang, “Using the MRTD based on coifman scaling functions to solve the problem of scattering,” Chinese Journal of Electronics, vol.29, No.12, 2001.
  [55] X. C. Wei and C. H. Liang, “A Comparison between the applications of orthonormal wavelet and dualorthonormal wavelet for the wavelet moment methods,” J. Microwaves, Vol.16, No. 4, 2000.
  [56] X. C. Wei and C. H. Liang, “The Fast solution of electromagnetic scattering using periodic wavelet transform,” J. Xidian University, Vol.27, No.2, pp.248-251, 2000.
  [57] X. C. Wei, C. H. Liang, and M. P. Jin, “Fast solution of 3D electromagnetic scattering using wavelet transform,” J. Radio Science, Vol.15, No.3, 2000.
中文会议论文
  [58] X. C. Wei and C. H. Liang, “The Solution of scattering from coated cylinder using wavelets package,” Proceeding of National Microwave Symposium, Changsha, P.R.China, Sept., 1999.
  [59] X. C. Wei and C. H. Liang, “The Scattering from IFS coarse cylinder,” Proceeding of National Microwave Symposium, Changsha, P.R.China, Sept., 1999.

  [60] X. C. Wei, X. J. Zhang and C. H. Liang, “The Solution of factor of fractal plane array using kronecker product,” Proceeding of National Microwave Symposium, Qingdao, P.R.China, Sept., 1997.