3. 2017.01-present: Associate Editor of 《IEEE Journal on Multiscale and Multiphysics Computational Techniques》；
  4. 2011-present: Associate Editor of 《IEEE Transactions on Components, Packaging, and Manufacturing Technology》；
  5. 2011-2017.02: Associate Editor of《International Journal of Numerical Modeling of Electronic Networks, Devices and Fields》；
  6. 2011-2012: IEEE Electromagnetic Compatibility Society Distinguished Lecturer；
  7. 2011 General Co-Chair of 2011 IEEE Electrical Design of Advanced Packaging Symposium (2011 IEEE EDAPS)；
  8. 2010-2014: Editorial Board Member of 《International Journal of RF and Microwave CAE》 ；

  9. 2001-present: Editorial Board Member of 《Journal of Electromagnetic Waves and Applications》and《Progress in Electromagnetics Research》；

  10. Technical Chair of Electrical Design of Advanced Packaging and Systems (EDAPS 2005) ；
  11. 2005 Session Chair and TPC of APMC’2005, Progress in Electromagnetic Research (PIERS’2005), Radio Frequency Integrated Technology( RFIT’2007), Electromagnetic Compatibility -Zurich in Singapore’ 2007, Asia-Pacific Electromagnetic Compatibility Conference (APEMC’2008), IEEE Electrical Design of Advanced Packaging and Systems( 2008 IEEE EDAPS), 2009 Global Symposium (GSM 2009), 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium (2009 IEEE EDAPS), and 2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium (2010 IEEE EDAPS’2010), etc.

       Long-Time Reviewer of Many IEEE Journals
  IEEE Trans. Microwave Theory and Techniques
  IEEE Trans. Electromagnetic Compatibility
  IEEE Trans. Electron Devices
  IEEE Trans.Antennas and Propagation
  IEEE Trans. Circuits and Systems I
  IEEE Trans. Magnetics
  IEE Proc-H: Microwave, Antennas Propagation
  Radio Science
  IEEE Trans. Plasmas
  IEEE Electron Device Letters
  IEEE Trans. Power Electronics